1000th Weightless SIG Member joins community

[Note: This item has been published for readers' reference]
NextG-Com joins Weightless SIG as core member

Press release

weightless is the logical enabler for M2M - bidinost

August 27th 2013. The Weightless SIG has announced that NextG-Com, protocol stack and wireless embedded system component developer, has joined the Weightless SIG as its one thousandth member. NextG-Com joined the SIG earlier this year [2013] as an associate member as a first step in understanding the opportunity for Weightless technology. Since this time the company has been developing a series of M2M terminal protocol stack solutions and related components.
The company has now migrated to ‘core’ membership of the SIG to take a more active and participative role in the working groups helping to define future developments of the standard.

Professor William Webb, CEO of the Weightless SIG, commented. “!We are delighted to have reached this significant milestone in our membership so early in the evolution of the Weightless ecosystem.”

He added that, “As we enter the next phase in our growth contributions from companies such as NextG-Com will be invaluable to our strategy.”

Weightless is a ground breaking wireless technology targeting machine communications (M2M) applications.

Built on a cellular architecture, Weightless is the only data pipe of its kind that has been specifically optimised for global, long range, infrequent transmission of small data packets generated by M2M applications.

Weightless is frequency agnostic and can use white space radio spectrum available within the gaps between TV transmissions.

Denis Bidinost, NextG-Com CEO, commented, “Joining the Weightless SIG as a Core member is a logical step for us.”

He continued, “We have life-time experience of developing and testing embedded cellular software systems and components based on 3GPP standards.”

“We see Weightless as the logical enabler for M2M application and service providers to deliver next generation solutions and we look forward to contributing our effort as this technology is brought to market.”

“As a company familiar with the challenges of working within the semiconductor and wireless industry, we expect our experience to further accelerate the technology.”

About Submit Release

Would you like to see your Press releases featured on GoMo News? If so, why not consider sponsoring pages on GoMo News? Email geoff (at) gomobilenews.com.
This article was published in M2M and tagged , , , , . Bookmark the permalink.

Leave a Reply

Your email address will not be published. Required fields are marked *

*

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>